Systems and methods for reconfiguring an ultrasound device

ABSTRACT

Systems and methods (the “utility”) presented herein provide for the assessment of acousto-electrical probes, such as their connections (e.g., transducer leads) and their response characteristics. For example, the utility may provide for readily evaluating transducer leads that have been broken and/or detached from transducers within an ultrasound probe. Due to the increasing complexity of ultrasound probes, identification of broken and/or detached transducer leads also becomes increasingly complex. Being able to identify such disconnected transducer leads may enable a person to repair, or “reterminate”, these transducer leads leading to a potentially substantial cost savings, the least of which being incurred by avoiding total replacement of an ultrasound probe.

CROSS-REFERENCE TO RELATED APPLICATIONS

This patent arises from an application that claims the benefit ofpriority, as a continuation, to U.S. patent application Ser. No.15/221,355, filed on Jul. 27, 2016, for “SYSTEMS AND METHODS FORRECONFIGURING AN ULTRASOUND DEVICE”, which is a continuation of U.S.patent application Ser. No. 13/430,261, filed on Mar. 26, 2012, for“ULTRASOUND DEVICE TESTING,” which is a divisional of U.S. patentapplication Ser. No. 12/062,852, filed on Apr. 4, 2008, for “SYSTEMS ANDMETHODS FOR RECONFIGURING AN ULTRASOUND DEVICE”, now U.S. Pat. No.8,143,898, which claims priority of U.S. Provisional application No.60/910,555, filed on Apr. 6, 2007, for “UNIVERSAL X-RAY TEST BED” eachof which is incorporated herein by reference in their entireties andpriority is claimed.

BACKGROUND

Generally, manufacturers of medical equipment, such as General Electric,Siemens, Phillips, build and service the medical equipment that theydevelop. These manufacturers maintain detailed specifications andcircuit diagrams for the equipment such that their service technicianscan perform repairs and they vigilantly protect such information inorder to protect their market share. For example, by closely guardingthe specifications and diagrams of the x-ray device, the manufacturermay prevent others from entering the market to service and repair theirbrand-name devices. And, by monopolizing the service and repair marketfor a particular piece of equipment, the manufacturer is able to extrudeeven more income from a sale thereof. Accordingly, the service andrepair costs associated with that device can be quite substantial, evenwhile the sale price of a particular x-ray device is also verysubstantial.

In many cases, medical devices are almost prohibitively expensive. Forexample, doctors and hospitals in smaller markets (e.g., small towns)are often unable to afford the costs associated with such devices. Evenif it were possible for the smaller market medical service providers toafford these medical devices, the costs associated with the service andrepair of the devices would likely put the devices' benefits out ofeconomic reach.

SUMMARY

Systems and methods (the “utility”) presented herein provide for theassessment of acousto-electrical probes, such as their connections(e.g., transducer leads) and their response characteristics. Forexample, the utility may provide for readily evaluating transducer leadsthat have been broken and/or detached from transducers within anultrasound probe. Due to the increasing complexity of ultrasound probes,identification of broken and/or detached transducer leads also becomesincreasingly complex. Being able to identify such disconnectedtransducer leads may enable a person to repair, or “reterminate”, thesetransducer leads leading to a potentially substantial cost savings, theleast of which being incurred by avoiding total replacement of anultrasound probe.

The utility may provide a means for connecting to a variety ofultrasound probes thereby providing, in essence, a universal means foridentifying broken and/or detached ultrasound transducer leads. Theseconnecting means may be implemented in variety of fashions such as aplurality of individual connectors configured with a single piece oftest equipment, wherein each connector is operable with a particularultrasound probe. Alternatively, the piece of test equipment may beconfigured with a communication interface that allows for the switchablereplacement of a variety of connectors, again wherein each individualconnector is operable with a particular ultrasound probe. In anotherembodiment, the piece of test equipment may be configured with anadaptable connection interface that communicates with a variety ofultrasound probe connectors. In this regard, the piece of test equipmentmay employ a multiplexing scheme that allows for a processor tocommunicate with each connector of an ultrasound probe, and thus eachtransducer lead of the ultrasound probe, without regard to theultrasound probe type.

In one embodiment, a system for determining electrical leads of anacousto-electrical probe that includes a plurality of transducersincludes a coupling device that includes a plurality of connectorsconfigured for individually coupling to the electrical leads of theacousto-electrical probe, wherein a number of connectors is greater thanor equal to a number of transducers in the probe. The system alsoincludes a processor communicatively coupled to the coupling device anda storage element configured for storing software instructions thatdirect the processor to generate one or more control signals, whereinthe one or more control signals are provided to the coupling device fora determination by the processor of an electrical characteristic (e.g.,electrical conductibility) of the electrical leads.

The connectors of the coupling device may be configured as a printedcircuit board. The processor is configured for determining a number ofthe electrical leads that are coupled to the coupling device. Thesoftware instructions may direct the processor to determine a type ofacousto-electrical probe. The software instructions may include aplurality of software modules, wherein each software module correspondsto one type of acousto-electrical probe. The software instructions mayalso include a report generation software module that directs theprocessor to indicate at least one broken electrical lead of theacousto-electrical probe.

The system may further include a display interface that displaysinformation to a user of the system, wherein the information indicatesthe electrical characteristic of the electrical leads. The system mayfurther include a detector that determines an electrical characteristicof the transducers of the acousto-electrical probe. In this regard, thedetector may apply a first of the one or more control signals to a firsttransducer of the acousto-electrical probe to determine a capacitance ofthe first transducer. The first of the one or more control signals maycharge a capacitance of the first transducer. The system may furtherinclude a counter that counts during charging of the capacitance of thefirst transducer and a comparator that compares a reference voltage to avoltage of the charged capacitance of the first transducer, wherein thecomparator generates a counter control signal used for stopping thecounter when the voltage of the charged capacitance passes the referencevoltage. The processor may determine the capacitance based at least inpart on a duration between starting and stopping the counter.

In another embodiment, a method of returning an acousto-electricaldevice to an operational status, wherein the acouso-electrical devicehas a plurality of transducers includes acquiring the acousto-electricaldevice from an industry segment, determining a type of theacousto-electrical device, and determining a number of electrical leadsfrom the transducers of the acousto-electrical device. The method alsoincludes providing a connection interface to the acousto-electricaldevice based on the type, wherein the connection interface has a numberof connectors that is greater than or equal to the number of electricalleads of the acousto-electrical device. The method also includesgenerating one or more control signals, transferring the one or morecontrol signals to the connector, determining conductivity of theelectrical leads of the acousto-electrical device based on the one ormore control signals, and providing a connection for at least one of theelectrical leads based on the determined conductivity.

Providing a connection for the at least one of the electrical leads mayinclude configuring a printed circuit board connection to the at leastone of the electrical leads. The printed circuit board connection may bea flexible printed circuit board connection. The method may furtherinclude configuring the acousto-electrical probe with reflective modulewhile transferring the one or more control signals to theacousto-electrical probe.

In another embodiment, a method of refurbishing an ultrasound devicehaving a plurality of transducers includes acquiring an ultrasound probefrom a first medical industry segment, wherein the ultrasound device isin at least a partially inoperable state. The method also includescoupling an adaptive test module to the ultrasound probe, determiningelectrical conductivity of transducer leads of the ultrasound probe. Themethod also includes, in response to determining the electricalconductivity of the transducer leads, determining at least one brokentransducer lead of the transducer leads; and reconfiguring the at leastone broken transducer lead to a conductive state to return the probe asecond medical industry segment.

The first medical industry segment and a second medical industry segmentmay be the same, such as a hospital, a health maintenance organization,a private doctor's office, an original equipment manufacturer, and aretailer of medical equipment.

Coupling the adaptive test module to the ultrasound probe may includeproviding a plurality of connectors with the adaptive test module. Thenumber of the connectors, and this regard, may be greater than or equalto a number of the transducer leads. Coupling the adaptive test moduleto the ultrasound probe may also include generating at least one controlsignal to determine a configuration of ultrasound probe coupled to theadaptive test module.

In another embodiment, a method of identifying inoperable leads of anultrasound probe includes providing a first connection interface,receiving an ultrasound probe connection interface with the firstconnection interface. The method also includes generating a plurality ofcontrol signals to interrogate connectors of the ultrasound probeconnection interface via the first connection interface and identifyingat least one broken lead of the ultrasound probe based on acorresponding at least one of the plurality of control signals.

Providing the first connection interface includes providing a pluralityof connectors with the first connection interface, wherein a number ofconnectors of the first connection interface is greater than or equal toa number of the connectors of the ultrasound probe connection interface.Identifying at least one broken lead of the ultrasound probe may includeprocessing a response to the corresponding at least one of the pluralityof control signals. Processing the response may include determining anOhm value based on the response to the corresponding at least one of theplurality of control signals.

Alternatively or additionally, providing the first connection interfacemay include providing the first connection interface with a plurality ofalternative connection interfaces. In this regard, each of the firstconnection interface and the plurality of alternative connectioninterfaces may be configured with a test tool. The method may furtherinclude multiplexing the control signals based on a type of theultrasound probe connection interface that is received. The method mayfurther include generating information that indicates the least onebroken lead of the ultrasound probe. The method may further includedisplaying the information to a user, wherein the information provides alocation of the at least one broken lead of the ultrasound probe withinthe ultrasound probe connection interface.

In another embodiment, a method of determining a capacitance capabilityof an electrical lead includes discharging stored capacitance of theelectrical lead, applying power to the electrical lead, and, during theapplication of power to the electrical lead, counting clock cycles froma microprocessor. The method also includes comparing a electrical leadvoltage to a reference voltage, stopping the counting of clock cycleswhen the electrical lead voltage passes the reference voltage,processing a number of counted clock cycles, in response to stopping thecounting of clock cycles to determine a capacitance of the electricallead. The reference voltage may be between about 3 and 6 volts. Theelectrical lead may be coupled to a transducer configured with anultrasound probe.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of a system for determining decoupled leads inan acousto-electrical probe.

FIG. 2 is an exemplary diagram of a connector for use with aretermination test tool.

FIG. 3 is another block diagram of a system for determining decoupledleads in an acousto-electrical probe.

FIG. 4 is a block diagram of an exemplary retermination test tool forrepairing an acousto-electrical device.

FIG. 5 is a circuit schematic of an exemplary retermination test toolfor repairing an acousto-electrical device.

FIG. 6 is a circuit schematic of an electrical characteristic sensingmodule of the exemplary retermination test tool that is used to senseindividual leads of transducers.

FIG. 7 is a circuit schematic of another electrical characteristicsensing module of the exemplary retermination test tool that is used tosense a test probe.

FIG. 8 is a circuit schematic of a mode select switch module of theexemplary retermination test tool.

FIG. 9 is a circuit schematic that illustrates a multiplexing portion ofan exemplary retermination test tool.

FIG. 10 is a flowchart of a process for reconfiguring anacousto-electrical probe.

FIG. 11 is a block diagram of an exemplary transducer characterizationmodule.

FIG. 12 is an illustration of an exemplary reflection module.

DETAILED DESCRIPTION OF THE DRAWINGS

While the invention is susceptible to various modifications andalternative forms, specific embodiments thereof have been shown by wayof example in the drawings and are herein described in detail. It shouldbe understood, however, that it is not intended to limit the inventionto the particular form disclosed, but rather, the invention is to coverall modifications, equivalents, and alternatives falling within thescope and spirit of the invention as defined by the claims.

FIG. 1 is a block diagram of a system 10 for determining decoupled leads13 in an acousto-electrical probe 11. Often, acousto-electricalelectrical probes (e.g., ultrasound probes), have leads that becomedetached from their respective transducers or broken due to general useand/or misuse. For example, a physician may hold an ultrasound probeunder his arm when examining a patient simply because the physicianrequires the use of two hands when examining a patient. In this regard,the cable containing the transducer leads of the ultrasound probe (e.g.,cable 18) may bend and twist in a manner that causes the transducerleads to break or detach after a period of time. Generally, however, theactually more complex and sensitive transducers of the ultrasound proberemain intact. Thus, repair of an ultrasound probe may be facilitated byrepairing the broken transducer leads (e.g., reterminating thetransducer leads).

Older model ultrasound probes generally had a few transducer leads.Modern ultrasound probes, however, have significantly increased thenumber of ultrasound leads because, among other reasons, processingcapabilities have improved. For example, as processor speeds increase sodo the resolution capabilities of an ultrasound device. Accordingly,ultrasound device manufacturers generally increase the number oftransducers within an ultrasound probe to increase the resolution of theoverall device as the processor capabilities come available. In someinstances, ultrasound probes contain as many as 360 transducer leads.This dramatic increase in the number of transducer leads has led to acorresponding complexity in the repair of ultrasound probes.Accordingly, manufacturers of the ultrasound probes merely providereplacement probes at a substantial cost to the physician rather thanrepairing the probe.

The system 10 provides a means for analyzing the leads 13 of anacousto-electrical probe 11 that may eliminate the need for replacementprobes. For example, the acousto-electrical probe 11 may assist inidentifying broken and/or detached transducer leads such that atechnician may repair those leads and alleviate the need for purchasinga new acousto-electrical probe. However, acousto-electrical probes aregenerally developed by a variety of manufacturers that adhere to noparticular standard. In this regard, the acousto-electrical probes varyalmost as much in the number of transducer leads 13 (shown in phantom)as they do in the different connector types. Accordingly, providing ameans for identifying broken and/or detached transducer leads 13 becomesfurther complicated.

The system 10 may alleviate the complexity of identifying broken and/ordetached transducer leads from a plurality of acousto-electrical probetypes. In this regard, the system 10 may include a connection interface12 that is configured for connecting to a plurality ofacousto-electrical probe types, such as the acousto-electrical probe 11.In this regard, the connection interface 12 may provide a means foruniversally connecting to acousto-electrical probes of varyingconnection types and numbers of transducer leads.

In one embodiment, the connection interface 12 includes a plurality ofconnectors 20 that are configured with the connection interface 12 basedon connection type information of known acousto-electrical probes. Forexample, the probe connection interface 19 ₁ may be a connector for acertain type of ultrasound probe (e.g., brand, model, etc.) for couplingto an ultrasound device of the same brand, model, etc. The connectioninterface 12 may have a plurality of connectors 20 that are configuredaccording to the probe connection interface 19 ₁ of that particularbrand, model, etc. However, when the system 10 is being used to test theultrasound probe of a different brand, model, etc., the probe connectioninterface (e.g., the probe connection interface 19 _(N), wherein N ismerely intended as an integer greater than 1) may have a differentnumber of connectors and/or a different connector configuration. In thisregard, the connection interface 12 may also include connectors 20 thatare configured according to known characteristics of the probeconnection interface 19. An example of such a connection interface 12 isshown and described in FIG. 2.

In FIG. 2, one exemplary connection interface 12 is shown in the form ofa solder mask diagram. For example, known configurations of ultrasounddevice connectors may be ascertained from physical inspection. Theseconfigurations may then be implemented via a circuit board by generatinga solder mask that has all of the connectors 20 of virtually all of theknown ultrasound device types. As ultrasound probes change, and thustheir respective connector configurations, the solder mask may bereconfigured as the newer ultrasound probes are introduced.

Although described with respect to implementing virtually every type ofknown ultrasound probe connector, the invention is not intended to be solimited. For example, a solder mask configuration may be implementedaccording to a desire to repair only certain types of ultrasound probes.That is, the solder mask may not include connectors 20 that are ofundesirable ultrasound probes. Accordingly, the connection interface 12,and thus the solder mask of FIG. 2, may be configured as a matter ofdesign choice, so as to form connection interfaces that are connectableto at least 2 different types of ultrasound probe connection interfaces.

Additionally, the connection interface 12 may be one that readilycouples to a probe connection interface 19. For example, components ofthe system 10, such as the processor 14 and the storage element 15, maybe configured in a single piece of test equipment. In this regard, thepiece of test equipment may allow for physical switching of theconnection interface 12 with other connection interfaces 12 such thatthe piece of test equipment can be used on a variety ofacousto-electrical probes 11. Alternatively, the piece of test equipmentmay be configured with a variety of connection interfaces 12 that theprocessor 14 may communicate with to determine a type ofacousto-electrical probe under test. For example, a plurality ofconnection interfaces 12, each of a particular ultrasound probeconnector configuration, may be configured with the piece of testequipment. When an ultrasound probe is coupled to one of the connectioninterfaces 12, the processor 14 may determine the type of ultrasoundprobe based simply on the fact that the ultrasound probe is connected toa corresponding connection interface 12. In either case, the processor14 may then perform various tests on the ultrasound probe as describedherein.

Returning now to FIG. 1, once the acousto-electrical probe 11 is coupledto the connection interface 12 via its probe connection interface 19, aprocessor 14 may retrieve a software module 16 from the storage element15 to determine the acousto-electrical probe 11 type (e.g., again, thebrand, model, etc.) and determine whether any broken and/or detachedtransducer leads exist with the acousto-electrical probe 11. Forexample, the software module 16 may include software instructions thatdirect the processor 14 to interrogate the connectors 20 of theconnection interface 12 to determine the number of transducer leadscouple to the connection interface 12 via the probe connection interface19. This interrogation may result in a determination of theacousto-electrical probe 11 type such that additional softwareinstructions may be processed by the processor to determine the brokenand/or detached transducer leads. For example, based on a particularconfiguration of the probe connection interface 19, and thus thenumber/configuration of transducer leads 13, a determination may be madeas to the type of acousto-electrical probe. In response, the processor14 may retrieve additional software instructions pertaining to the typeof acousto-electrical probe that direct the processor to test thetransducer leads 13 of the probe connection interface 19. In thisregard, the software instructions may direct the processor to generate acontrol signal for connectors 20 that are in contact with the connectorsof the probe connection interface 19. The processor 14 may then processresponses to the control signals to determine whether individualtransducer leads 13 are broken/detached. For example, the controlsignals may be used as part of an ohm metering process. In this regard,the processor 14 will determine that a transducer lead 13 is eitherbroken or detached from its transducer when the resistance of aparticular transducer lead 13 is substantially high (e.g., infinite).

Additionally, the ohm metering process performed by the processor 14 maydetermine electrical shorts between transducer leads. For example,although less likely, individual transducer leads generally haveshielding that may deteriorate from rubbing one another over time. Theindividual transducer leads 13 may, therefore, come into direct contactwith one another and thereby decrease the overall resistance of multipletransducer leads 13.

In one embodiment, the processor 14, as directed by the softwareinstructions, may record certain information pertaining to theacousto-electrical probe 11 under test. For example, the processor 14may store information regarding the transducer leads 13 that are brokenand/or detached within a database 17 for future use. In this regard, atechnician working on a particular acousto-electrical probe 11 mayaccess the database and retrieve information regarding that particularacousto-electrical probe to determine which transducer leads 13 may bemore susceptible to breakage and/or detachment. In other words, theprocessor 14 may maintain certain statistics by acousto-electrical probe11 type.

FIG. 3 illustrates another block diagram of the system 10 as describedin FIG. 1. For example, the processor 14 is in communication with a“universal” connection interface 12 that is used for connecting probeconnection interface 19 of an ultrasound probe. The processor 14 mayretrieve the device determination software module 33 to initiallydetermine the type of ultrasound probe under test (i.e., the ultrasoundprobe communicatively coupled to the connection interface 12). Thedevice determination software module 33 may include softwareinstructions that direct the processor 14 to interrogate the connectioninterface 12 to determine a transducer lead configuration of the probeconnection interface that is coupled to the connection interface 12.

Upon interrogating the probe connection interface 19, the processor 14may retrieve various software modules from the storage element 15 toconduct various tests on the acousto-electrical probe. These softwaremodules may include software instructions specific to particular modelsof ultrasound probes. For example, the software module 32 may be usedfor conducting tests on a first ultrasound device type whereas thesoftware module 32 may be used for conducting tests on a second devicetype. In this regard, the storage element 15 may include a plurality ofsoftware modules that are “callable” by the device specific softwaremodules 32. For example, once a particular ultrasound probe has beendetermined and its appropriate software module 32 has been called, thedevice specific software module 32 may then call one or more of thesoftware modules 34, 36, 37, and 38 to perform certain tests on theultrasound probe.

One such test that may be performed on the ultrasound probe, asmentioned above, includes a broken and/or detached transducer lead test.Such may be implemented by the processor 14 when the ohm meter softwaremodule 34 directs the processor to generate control signals for theconnectors 20 that are in communication with the ultrasound probeconnection interface. In one embodiment, the ohm meter software module34 and the device termination software module 33 may be implemented as asingle software module. For example, the software module may beconfigured to direct the processor 14 to generate control signalsapplicable to each connector 20 of the connection interface 12. As it isunlikely that every transducer lead from an ultrasound probe is brokenand/or detached, a transducer lead configuration may be determined froma portion of the overall number of transducer leads of the ultrasoundprobe. For example, an ultrasound probe with 192 transducers has 192transducer leads in a particular connector configuration. If the ohmmeter software module 34 determines that there are 190 transducer leadconnections, the ohm software module 34 may determine that theultrasound probe is indeed a 192 transducer ultrasound probe.Accordingly, the invention is not intended to be limited to a particularembodiment with such distinct software modules.

The storage element 15 may also include a report generation softwaremodule 35 that is used to provide the user of the system 10 with a needfor quickly ascertaining various problems associated with the ultrasoundprobe under test. For example, the report generation software module 36may direct the processor 14 to communicate information pertaining tobroken and/or detached transducer leads to the display interface 31. Thedisplay interface 31 may be configured from a variety of informationrendering devices, such as LCDs, LEDs, and/or printers. In oneembodiment, the display interface may be alternatively or additionallyimplemented as a Personal Computer (PC) that displays the informationvia a computer monitor. Such information may be useful to the personusing the system 10 troubleshooting the ultrasound probe under test. Inone embodiment, the information is also conveyed to a database (e.g.,the database 17 of FIG. 1) such that statistical information may bedeveloped on a probe by probe basis. For example, the system 10 maycompile statistical information regarding a certain type of ultrasoundprobe such that the processor 14 may retrieve the information from thedatabase for display to a person using the system 10 to test aparticular ultrasound probe.

In one embodiment, the software modules 37 and 38 may be used to detectthe operability of the transducers themselves. For example, the transmitsoftware module 37 may direct the processor 14 to generate a pulsedcontrol signal that, in essence, “pings” a particular transducer suchthat the transducer generates an acoustic pulse (i.e., and ultrasoundpulse). In this regard, the storage element 15 may also include areceive software module 38 that directs the processor to process asignal as received by the transducer. For example, a transducer mayreceive an acoustic pulse that is reflected from a target. Thetransducer may, in turn, convert the received acoustic signal into anelectronic signal. The receive software module 38 may direct theprocessor 14 to convert the electronic signal into a digital signal(e.g., via analog-to-digital conversion, or ADC). Once in digital form,the receive software module 38 may direct the processor to call thediagnostic software module 36. In this regard, the diagnostic softwaremodule 36 may analyze the phase amplitude of the received acousticsignal via digital signal processing to determine whether a particulartransducer is operating properly (e.g., operating according to certainguidelines or standards). The frequency and/or phase characterization isshown and described below in greater detail in FIGS. 11 and 12.

Although shown and described with respect to all testing softwaremodules (e.g., the software modules 34, 36, 37, and 38) being configuredwithin as part of a single system 10, the illustrated embodiment ismerely intended as an example of how the system 10 may be configured. Inother embodiments, the system 10 may be configured with fewer or morethan those software modules that are shown. For example, in oneembodiment, the system 10 may be configured as a field service tool thatis operable to test an ultrasound device while on site. In this regard,the system 10 may not require the functionality of determining whethertransducer leads are broken and/or detached, as such may requireoff-site repair. Accordingly, the system 10 may be configured with lessfunctionality so as to only generally provide a certain level of“health” of the ultrasound device. Such an embodiment may include thetransmit, receive, and diagnostic software (i.e., software modules 36,37, and 38) as a means for simply determining whether the ultrasounddevice is operable. Moreover, even though an ultrasound probe withbroken and/or detached leads may require off-site repair, a fieldservice tool may be configured to simply diagnose the leads to determinewhether the ultrasound probe requires off-site repair.

FIG. 4 is a block diagram of an exemplary retermination test tool (RTT)100 for use by a repair operator to quickly and efficiently test anacousto-electrical probe 128. The acousto-electrical probe 128 isgenerally operable to emit acoustic signals and to receive echoes fromthose signals. In general, acousto-electrical probes generate andreceive acoustic signals using a plurality of transducers located in thescan head of the probe. One type of transducer commonly used inacousto-electrical probes employs the piezoelectric effect to send andreceive acoustic signals. In this type of probe, there is typically aplurality of crystals (e.g., quartz crystals) generally referred to aspiezoelectric crystals positioned inside the scan head of the probe.When an electrical current is applied to the crystals, they change shaperapidly. The rapid shape changes, or vibrations, of the piezoelectriccrystals produce acoustic waves that travel outward from theacousto-electrical probe. Conversely, when acoustic waves hit thecrystals, they emit electrical currents. Therefore, the piezoelectriccrystals may be used to send and receive acoustic waves. Generally, eachof these transducers is soldered onto a printed circuit board (PCB)inside the scan head of the probe. Furthermore, a cable harness may beattached to the scan head to allow the probe to be connected to acontrol device such as an ultrasound machine. The cable harness usuallyincludes a connector at the opposite end of the scan head which mateswith an interface on an ultrasound machine. Inside the cable harness,the transducers are connected to the connector by a plurality of coaxialleads that are soldered to the PCB. During use in the field, theinternal wiring of the acousto-electrical probe 128 can fatigue andbreak, typically at the PCB end, causing open circuits or short-circuitsat one or more leads, which may require that the acousto-electricalprobe be replaced. The RTT 100 may be used by an operator to providenotification as to which lead(s) require retermination (e.g., thoseleads that are broken and/or detached).

In this embodiment, the RTT 100 includes a controller 104, an analogmultiplexer 108, the comparators 112, 116, 120, and a test probe 124. Inthe various modes of operation described below, the acousto-electricalprobe 128 under test may be connected to the RTT 100 via a connector 132of the RTT 100. Generally, the RTT 100 can be configured to mate withthe connector of virtually any type of acousto-electrical probe. In thisembodiment, to enable the RTT 100 to test a single lead of theacousto-electrical probe 128 at a time, the connector 132 iselectrically coupled to a 1:192 channel multiplexer 108. In this regard,the output node 109 of the multiplexer 108 may be electrically coupledto a single lead of the acousto-electrical probe 128. The controller 104may be operable to select which lead is electrically coupled to theoutput node 109 by controlling the multiplexer 108 via the multiplexercontrol lines 160. Furthermore, the output node 109 may be coupled to atest node 158, which may be used by the RTT 100 to determine variouselectrical characteristics of individual leads of the acousto-electricalprobe 128, as described below.

The RTT 100 is now described in reference to its various modes ofoperation. The RTT 100 may generally have at least three general modesof operation. The first mode is Ground Scan mode, and may generally beused to identify leads that are improperly connected to ground. This canoccur for various reasons, such as when the cable of theacousto-electrical probe 128 has been crushed or bent (e.g., duringhandling, shipping, through general use, etc.). In the Ground Scan mode,the RTT 100 may scan through the leads of the acousto-electrical probe128 and sense whether each lead is grounded. To achieve this, thecontroller 104 may control the multiplexer 108 to address an inputchannel that corresponds to an individual lead on the acousto-electricalprobe 128. As discussed above, this causes an individual lead to beelectrically coupled to the test node 158, which permits the RTT 100 tosense its electrical characteristics. To determine whether the selectedlead is grounded, the controller 104 may drive thedischarge/ground/probe node 180 high (e.g., a logical one). If the leadaddressed by the multiplexer is grounded, the test node 158 remainsgrounded. Conversely, if the addressed lead is not grounded, the testnode 158 is pulled high through resister 166. Therefore, the voltage atthe test node 158 is determinant upon whether the lead addressed by themultiplexer 108 is grounded or open.

To sense the voltage at the test node 158, the controller 104 may usethe comparator 116. For example, the test node 158 may be coupled to thenon-inverting input of the comparator 116 for comparison with areference signal. The reference signal, in this embodiment, is generatedby using a voltage divider (e.g., formed by the resistors 168, 172, and176) coupled to a voltage source of 5 volts. This reference signal isinput to the inverting input of the comparator 116. Furthermore, thecontroller 104 detects the output of the comparator via the ground scaninput node 192. Those skilled in the art, however, should readilyrecognize that other types of voltage sensing may be used. The resultsof the Ground Scan may then be communicated by the controller 104 to theoperator in any number of ways. For example, the controller 104 mayinclude a serial interface 136 to communicate data to a PC.Alternatively or additionally, an exterior display such as an LCD may becoupled to the controller 104 to display information requested by theoperator.

Another mode of the RTT 100, the Probe Scan mode, may be used by theoperator to identify leads that are in contact with the test probe 124.This mode generally allows the operator to identify a lead under test soas to determine the location on a PCB to reterminate the lead. Toachieve this functionality, the RTT 100 may include circuitry thatenables it to sense when a lead addressed by the multiplexer 108 is incontact with the test probe 124. Specifically, the controller 104 maydrive the test node 158 high through the resistor 166 by driving thedischarge/ground/probe node 180 high. Then, the controller 104 may causethe multiplexer 108 to continuously cycle through the connector pins154, which causes a high voltage (e.g., about 5 volts) to appear on thelead that is addressed by the multiplexer 108.

The operator may use the test probe 124 to probe various leads on theacousto-electrical probe 128. The test probe 124 may be connected tocircuitry which permits the RTT 100 to determine when the test probe 124is in contact with a node that is at a high voltage (e.g., about 5volts), so that it may sense when the test probe 124 is in contact withthe lead addressed by the multiplexer 108, as described above. In thisregard, the controller 104 pulls the voltage on the test probe 124 toground by pulling the test probe pulldown node 125 low (e.g., logicalzero) through a resistor 152. When the test probe 124 is in contact witha lead of the acousto-electrical probe 128 addressed by the multiplexer108, the voltage on the test probe 124 is driven high. Conversely, whenthe test probe 124 is in contact with a lead that is not addressed bythe multiplexer 108, the voltage on the test probe 124 is driven lowthrough the pulldown resistor 152.

To sense the voltage at the test probe node 126, the controller 104 mayuse the comparator 120. For example, the test probe node 126 may becoupled to the non-inverting input of the comparator 120 for comparisonwith a reference signal. The reference signal, in this embodiment, isgenerated by using a voltage divider (e.g., formed by the resistors 144and 148) coupled to a voltage source of about 5 volts. This referencesignal is input into the inverting input of the comparator 120. In thisregard, the comparator 120 signals to the controller 104 via the testprobe scan input node 121 whether the test probe 124 is at a high orground voltage. The controller 104 may then use this information todetermine which leads of the acousto-electrical probe 128 are in contactwith the test probe 124. As in other operational modes, the controller104 may communicate the information to the operator by transmitting datato an external device, such as an LCD or PC.

Another mode of the RTT 100 may be generally referred to as theCapacitance Scan mode. The Capacitance Scan mode may be used todetermine the relative capacitance of each of the leads on theacousto-electrical probe 128. This mode may operate by measuring thelength of time it takes to charge the capacitance of a lead to a knownvoltage through a high-value resistor. In this embodiment, thecontroller 104 first directs the multiplexer 108 to address one of theconnector pins 154 that corresponds to an individual lead on theacousto-electrical probe 128. The capacitance in the lead may first bedischarged to ground through a resistor 166 by having the controller 104pull the discharge node 180 low. After the capacitance has beendischarged, the discharge node 180 may then be placed into a highimpedance state by the controller 104. Next, the controller 104 drivesthe charge node 182 high and starts an internal counter at substantiallythe same time. While the counter is counting, the charge node 182charges the capacitance of the transducer lead through the high-valueresistor 162.

The controller 104 may use the comparator 116 to determine when thevoltage on the lead has reached a certain level (e.g., about 2.5 volts,representing a full charge of the transducer lead capacitance). In thisregard, the test node 158 may be coupled to the non inverting input ofthe comparator 112 for comparison with a reference signal. The referencesignal, in this embodiment, is generated by using a voltage divider(e.g., formed by the resistors 168, 172, and 176) coupled to a voltagesource of about 5 volts. The reference signal is input into theinverting input of the comparator 116. In this embodiment, when thevoltage of the lead rises to about 2.5 volts, the output of thecomparator 116 is driven high. The controller 104 senses the output ofthe comparator 116 through the capacitance-scan input node 194. When thecontroller 104 detects that the comparator 116 has been “tripped”, thecontroller 104 stops the counter.

The count from the counter can then be used by the controller 104 todetermine the capacitance of a single lead of the acousto-electricalprobe 128 using known relationships between capacitance, resistance, andcharge times. For example, the change in time required to charge acapacitor to roughly 63 percent of full of its initial voltage may bereferred to as a time constant τ, which is directly proportional to theresistance and capacitance of a circuit. Practically speaking, acapacitance is fully charged after 5 time constants, or 5·τ. Thus, thecontroller may determine the capacitance of the transducer lead asfollows: C=5·τ·R.

Once computed, the controller 104 may then direct the multiplexer 108 toaddress another pin and repeat the steps described above to measure therelative capacitance of each of the leads of the acousto-electricalprobe 128. As in the previously described modes of operation, thecontroller 104 may communicate the capacitance measurements to theoperator via an external device that may include a display element.

FIGS. 5-8 together illustrate an exemplary circuit schematic of an RTT250 that can be used to implement the RTT 100 embodiment of FIG. 4. TheRTT 250 includes, in this embodiment, a 68HC11 microcontroller 200 thatcontrols the operation of the various components of the RTT 250. Themicrocontroller 200 is also configured to perform data processingfunctions to determine multiple electrical characteristics of individualleads of an acousto-electrical probe. The 68HC11 is a CISCmicrocontroller family originally from Motorola, now produced byFreescale Semiconductor, that is used in many applications includingbarcode readers, hotel card key writers, amateur robotics, and variousother embedded systems. Although other microcontrollers with similarfunctionality may be used, the 68HC11 microcontroller is used in thisembodiment due to its memory capabilities, I/O features, andflexibility.

The specific functionality of the RTT 250 is now described in referenceto certain operational modes. In Ground Scan mode, the RTT 250 may beused to determine which leads of an acousto-electrical probe areimproperly grounded. In this regard, the microcontroller 200 may firstdrive the CHARGE node to about 5 volts. This causes the test node 300shown in FIG. 6 to rise to about 5 volts through the resistor R500. Thetest node 300 may be electrically coupled to the output of a multiplexer(e.g., the multiplexer 108 shown in FIG. 4) via the RAIL_SHORT_TESTnode, which may be electrically coupled to an individual lead of anacousto-electrical probe. The microcontroller 200 may then outputcontrol signals on the MUX_D0-MUX_D7 lines to direct the multiplexer toaddress an individual lead. The specific details of implementing andcontrolling the multiplexer are described below in FIG. 5.

Once an individual lead is addressed by the multiplexer, the RTT 250 maythen determine whether the lead is grounded. If a lead is not grounded,the voltage at the test node 300 remains at about 5 volts due to thevoltage on the CHARGE line. Conversely, if a lead is grounded, thevoltage at the test node 300 is pulled to ground.

In FIG. 6, an electrical characteristic sensing module 275 sensesindividual leads of a transducer. In this regard, a comparator 306 ofthe sensing module 275 may be used to sense the voltage of an individuallead by coupling the test node 300 to its non-inverting input. A threeinput diode 328 is also coupled to the non-inverting input of thecomparator 306 to act as a precision regulator, however, other devices,such as operational amplifiers may be used. The inverting input of thecomparator 306 may be set to a reference voltage (e.g., 2.44 volts) bythe voltage divider implemented using a resistor R16 (e.g., 649Ω), aresistor R17 (e.g., 2.74 kΩ), and a resistor R18 (e.g., 3.24 kΩ). Theoutput of the comparator 306 may be electrically coupled to an input ofthe microcontroller 200 via the SCAN_LO line, as shown in FIG. 5. When alead addressed by the multiplexer is grounded, the test node 300 and thenon-inverting input to the comparator 306 is also grounded. Since thevoltage at the non-inverting input of the comparator 306 will be lowerthan the voltage on the inverting input (e.g., 2.44 volts), thecomparator 306 drives the SCAN_LO line to ground. This in turn may alertthe microcontroller 200 that an individual lead is grounded. Conversely,when a particular lead addressed by the multiplexer is open, the testnode 300 remains at about 5 volts, as previously described. In thissituation, the comparator 306 may drive the SCAN_LO line high due to thevoltage on the non-inverting input being greater than the voltage on theinverting input. The microcontroller 200 may then direct the multiplexerto scan through each of the individual leads to determine whether eachlead is improperly grounded.

When operating in Probe Scan mode, the microcontroller 200 may drive theCHARGE node to about 5 volts which sets the voltage at the test node 300to about 5 volts through the resistor R500. The microcontroller 200 maythen direct the multiplexer to address an individual lead of anacousto-electrical probe by outputting control signals on theMUX_D0-MUX_D7 lines. As described above, this causes the lead addressedby the multiplexer to be driven to about 5 volts.

The operator may then use a test probe (e.g., the test probe 124 shownin FIG. 4), to probe various leads on an acousto-electrical probe. Inthis embodiment, the test probe is electrically connected to theTEST_PROBE line shown in FIG. 6. To enable the test probe to be used tosense the voltage on individual leads, the microcontroller 200 pulls thevoltage on the TEST_PROBE line to ground through the COMP_PULLUP nodeand a resistor R4 (e.g., 10 kΩ).

In order to determine whether the test probe is in contact with a leadaddressed by the multiplexer, the comparators 308 and 312 may be used tosense the voltage on the TEST_PROBE line, as illustrated with the testprobe sensing module 310 of FIG. 7. In this regard, the TEST_PROBE linemay be coupled to the non-inverting input of the comparator 312, and theinverting input of the comparator 308. The inverting input of thecomparator 312 and the non-inverting input of the comparator 308 may beset at a reference voltage (e.g., 2.5 volts) through the voltage dividerformed by the resistors R11 and R13 (e.g., 3.24 kΩ each). The operatormay then place the test probe in contact with one or more leads of theacousto-electrical probe under test. When the test probe is in contactwith a lead that is not addressed by the multiplexer, the voltage on theTEST_PROBE line remains at ground due to the COMP_PULLUP line beinggrounded by the microcontroller 200. However when the test probe is incontact with a lead addressed by the multiplexer, the voltage on theTEST_PROBE line is about 5 volts, since the lead is electrically coupledto the test node 300, which is about 5 volts as described above. Thecomparators 308 and 312 sense the voltage on the TEST_PROBE line andoutput corresponding signals to the microcontroller 200 on the PROBE_HIand PROBE_LO lines, respectively. The microcontroller 200 may then storethe data, and notify the operator which leads are in contact with thetest probe.

In the Capacitance Scan mode, the microcontroller 200 may direct themultiplexer to address a pin corresponding to a lead of anacousto-electrical probe, such as the acousto-electrical probe 128 shownin FIG. 4. As in previously described operational modes, an individuallead (e.g., a lead addressed by the multiplexer) may be electricallycoupled to the test node 300. Prior to starting the capacitancemeasurement, the microcontroller 200 may discharge the capacitance inthe lead. This may be achieved by driving the DISCH_TEST node to ground,which discharges the capacitance in the lead to ground through aresistor R23 (e.g., 2.15 kΩ). The microcontroller 200 may then place theDISCH_TEST node in a high impedance state. To start the capacitancemeasurement, the microcontroller 200 may drive the CHARGE node to about5 volts and start a 16-bit internal counter at substantially the sametime. While the counter is counting, the voltage on the CHARGE nodecharges the capacitor in the lead through the resistor R500 (e.g., 2.2MΩ). The resistance of the resistor R500 may be chosen so that thecapacitance may be measured with a requisite accuracy. In this regard,if the resistance is too low, the capacitor may charge very quickly. Inthis case, the error in the capacitance measurement may be high becausethe time to charge the capacitor may not be measured accurately by thecounter. For example, suppose the counter counts at a rate of one countper microsecond. If the resistance of the resistor 162 causes thecapacitor to charge in 0.5 microseconds, the output of the counter maynot be very useful. Problems may also arise if the resistance of theresistor 162 is too high. For example, errors may be introduced in themeasurement due to leakage currents of other components. Also, if thecapacitor takes too long to charge because of the high resistance valueof the resistor 162, the internal counter may overflow which may resultin inaccurate capacitance measurements. Moreover, a high resistancevalue may cause the Capacitance Scan to take an unacceptable length oftime to measure the capacitance of all the leads in anacousto-electrical probe.

To sense the voltage level of capacitor, the controller 200 may use acomparator 302. The non-inverting input of the comparator 302 may be setto a reference voltage (e.g., 4.5 volts) through the voltage dividerformed by the resistor R18 (e.g., 3.24 kΩ), the resistor R17 (e.g., 2.74kΩ), and the resistor R16 (e.g., 649Ω). The inverting input of thecomparator 302 may be electrically coupled to the test node 300 whichcorresponds to an individual lead. In operation, the output of thecomparator 302 may be tripped when the capacitor voltage rises to thereference voltage. The microcontroller 200 senses the output of thecomparator 302 via the SCAN_HI node, as shown in FIG. 6. When themicrocontroller 200 detects that the output of the comparator 302 hasbeen tripped, the microcontroller 200 stops the counter. Then, usingknown relationships between capacitance, resistance, and charge time,the count from the counter can be used to determine the capacitance ofan individual lead of the acousto-electrical probe. For example, themicrocontroller 200 may use an empirically derived lookup table todetermine the capacitance when provided with a number from the counterthat corresponds to a length of time. Alternatively, the microcontroller200 may input the number returned from the counter into a formula thatyields the capacitance of a lead. Once the capacitance of an individuallead has been measured, the microcontroller 200 may direct themultiplexer to address another pin corresponding to a lead on theacousto-electrical probe and repeat the steps described above for eachlead under test. The capacitance of each of the leads may then becommunicated to the operator via an external device, such as an LCD orPC.

Other circuitry may also be interfaced to the microcontroller 200. Forexample, an 8 MHz clock oscillator 208 may be connected to the EXTAL pinof the microcontroller 200 through a resistor R2 (e.g., 10Ω) to generateclock pulses required for the operation of the microcontroller 200.Additionally, a three pin connector 204 may be connected to theMODB/VSTBY pin of the microcontroller 200. The connector 204 permits themicrocontroller 200 to be placed into run mode and programming mode bymodifying the position of a jumper 205. As stated above, themicrocontroller 200 may also be interfaced with an LCD through an LCDconnector 234. The LCD may be operable to display information about theleads of an acousto-electrical probe that may be helpful to theoperator. To control the operation of the LCD, the microcontroller 200may use the PB0-PB7 and PD2-PD4 pins. A potentiometer 230 (e.g., 10 kΩ)may also be coupled to the LCD connector 234 to allow the operator toadjust the contrast of the LCD. Additionally, a heartbeat LED 226 may becoupled to the microcontroller 200 to provide status information to theoperator. Such status information may include operational modes, errorcodes, or the like. Moreover, the RESET pin on the microcontroller 200may also be interfaced to external reset circuitry to provide the RTT250 with reset capabilities. For example, a reset switch 212, a diode222, a resistor R3 (e.g., 47.5 kΩ), and a capacitor C16 (e.g., 1 uF) maybe used to provide reset circuitry for the microcontroller 200.

Additionally, the RTT 250 may be configured with a mode select switch324, as illustrated with the mode select switch module 320 of FIG. 8.For example, when a user wishes to implement one of the scans, such asthe Ground Scan, the user may input such a request via a user interface(e.g., a button that connects a switch or a software interface thatinitiates the Ground Scan mode). In this regard, the mode select switch324 may receive the input via the mode switch inputs such that the modeselect switch 324 properly addresses the test probe as describedhereinabove.

As discussed above, the RTT 250 may also be configured to include anexternal device, such as a PC. The transmit/receive pins (i.e., RXD andTXD) of the microcontroller 200 may be connected to a serialdriver/receiver 218. The serial driver/receiver 218, in this embodiment,is an RS-232 integrated circuit (e.g., a MAX232 produced by MaximIntegrated Products, Inc.) that is used to drive serial transmit/receivesignals between the microcontroller 200 and a PC. The serialdriver/receiver 218, in this embodiment, may be connected to an RS-232connector 214. This configuration allows the microcontroller 200 tocommunicate to a PC via a serial communication link. In this embodiment,the previously described operational modes of the RTT 250 may be used inconjunction with a custom software program running on the PC to providea user-friendly interface for testing and repairing acousto-electricalprobes. For example, the program may display a diagram of the PCB of theacousto-electrical probe under test including all of its solder pads.When the operator touches a lead of the acousto-electrical probe to thetest probe of the RTT 250, the program may visually indicate whichsolder pad on the PCB the lead should be terminated. Alternatively oradditionally, the program may visually or audibly alert the operatorwhen a particular lead is in contact with the test probe of the RTT 250.The operator may then connect another lead to the test probe andcontinue in this fashion until all the leads have been properlyterminated. The program may also be configured to visually or audiblyreport which leads are grounded or open. For example, the operator mayinput a command to the PC that causes the PC to display a listing of allthe leads that are grounded. The program may also be configured todisplay the capacitance of one or more leads in response to a commandfrom the operator. The capacitance may be displayed numerically, inchart form, or any other suitable form. The program may also beconfigured to test numerous types of acousto-electrical probes. Forexample, the program may provide a menu where the operator may select aspecific acousto-electrical probe from a list. If acousto-electricalprobes that are desired to be tested are not included in the menu, theprogram may also permit the operator to input characteristics (e.g.,number of leads, PCB diagrams, etc.) of the acousto-electrical probes sothat they may be tested. Furthermore, the program may be configured toautomatically detect the type of acousto-electrical probe connected tothe RTT 250 based on one or more characteristics of the probe by usingone or more of the previously described operational modes.

Although shown and described as a circuit that is configured tocommunicate with a PC or other device via the RS-232 connector 214, theinvention is not intended to be so limited. For example, othercommunication schemes (e.g., parallel communications, serial Ethernetcommunications, IEEE 1394 communications, etc.) could be configured withthe RTT 250 to convey data. Additionally, the RTT 250 may be configuredas a card that operates within the constructs of the PC's operatingsystem.

FIG. 9 is a circuit schematic that illustrates an exemplary multiplexingsystem 400 and various control circuitry that may be used in an RTT,such as the multiplexer 108 of the RTT 100 of FIG. 4. More specifically,FIG. 9 illustrates an implementation of a 1:192 channel multiplexingsystem using thirteen 1:16 channel multiplexers. In this embodiment, acontroller 404 (e.g., the controller 200 shown in FIG. 5) maycommunicate with electrical sensing circuitry 432 and thirteen 1:16channel multiplexers (e.g., the multiplexers 406, 408, 410) to testtransducer leads of an acoustic electrical probe that is communicativelycoupled via the multiplexing system 400. The multiplexers may be anytype of 16 channel analog multiplexer/demultiplexer such as the CD4067multiplexer manufactured by Texas Instruments. Each multiplexer is shownto have 16 input channels (i.e. CH0-CH15), an output channel (i.e. COM),and four control lines (i.e. S0-S3). The multiplexer 406, in thisembodiment, serves as a master multiplexer. Although only two are shownfor simplicity, twelve slave multiplexers (e.g. the slave multiplexer408, the slave multiplexer 410) may be electrically coupled to themaster multiplexer 406. The multiplexing system 400 may be configured toallow the controller 404 to direct the multiplexing system to select anindividual lead on an acousto-electrical probe using the output controlsignals MUX_D0-MUX_D7. The input channels of each of the twelve slavemultiplexers may be electrically coupled to connector pins that areconnected to individual leads of the acousto-electrical probe. Theoutput of each slave multiplexer (e.g., the slave multiplexers 408 and410) may be electrically coupled to an input channel of the mastermultiplexer 406. The output of master multiplexer 406 may beelectrically coupled to a test node 426, which may be used by theelectrical sensing circuitry 432 to determine one or more electricalcharacteristics of an individual lead of the acousto-electrical probe.The MUX_D0-MUX_D3 lines of the controller 404 may be coupled to the fourcontrol lines S0-S3 of each slave multiplexer. Similarly, theMUX_D4-MUX_D7 lines of the controller 404 may be coupled to the fourcontrol lines S0-S3 of the master multiplexer 406. In thisconfiguration, the controller 404 may use the MUX_D4-MUX_D7 controllines to address a particular slave multiplexer, and the MUX_D0-MUX_D3control lines to address a specific pin on a slave multiplexer.Therefore, the controller 404 can effectively implement a 1:192multiplexer to test an acousto-electrical probe having up to 192 leadsusing readily available 1:16 channel analog multiplexers. Once anindividual lead is selected and therefore electrically coupled to thetest node 426, the electrical sensing circuitry 432 may function inaccordance with the various operational modes discussed above to senseone or more electrical characteristics of the lead under test. However,the invention is not intended to be so limited. The embodiment herein ismerely shown with a 1:192 multiplexer because acousto-electrical devicesare generally configured with a maximum of 192 leads. If such a devicewere to use more leads (e.g., to improve resolution), the multiplexercould be adapted to meet the requirements of the device. For example,should an acousto-electrical probe be configured with more than 192transducers, and thus more than 192 transducer leads, the multiplexingsystem 400 may be configured with more master/slave multiplexers toaccommodate the increased number of connections. Accordingly, theembodiment shown herein is merely intended to show one example of anadaptable acousto-electrical probe testing tool.

FIG. 10 is a flowchart of a process 500 for reconfiguring anacousto-electrical probe, such as ultrasound probe. For example, asdescribed hereinabove, ultrasound probes may find themselves in a stateof disrepair due to misuse, neglect, and even general handling. In suchcases, an ultrasound probe often has components that are still operable,such as the transducers configured at the probe/human interface. It isoften the case that the transducer leads themselves are the componentsthat are no longer operable (e.g., broken and/or detached from thetransducers). All too often, a medical industry segment (e.g., ahospital with, a doctor's office, and original equipment manufacturer, aretailer, etc.) employing such a device would simply replace theultrasound probe at a relatively substantial cost. In this regard, theprocess 500 provides a means for returning an acousto-electrical probeto an operational status ready for reintroduction to the medicalindustry segment.

The process 500 may initiate when the acousto-electrical probe isacquired from the medical industry segment, in the process element 501.For example, once the acousto-electrical probe has been deemedinoperable or at least not in compliance with a particular standard, themedical industry segment (e.g., a doctor's office, hospital, or thelike) may request replacement of the acousto-electrical probe. In thisregard, a configuration facility may acquire the acousto-electricalprobe of the medical industry segment and provide the medical industrysegment with a temporary acousto-electrical probe (e.g., a loaner probe)or even a permanent replacement probe (e.g., a reconfigured probe).

Once acquired, a determination may be made as to the type ofacousto-electrical probe (e.g., brand, model, etc.), in the processelement 502. In this regard, a determination may be made as to thenumber of transducer leads of the acousto-electrical probe. In responsethereto or as a part of the determination process, a connection may beprovided to the probe in the process element 503. For example, auniversal connection interface may be configured with a number ofconnectors that is greater than or equal to the number of leads of anultrasound probe. This universal connection interface may be coupled toa processor which interrogates connectors of the connection interface todetermine the number of transducer leads connected via the associatedprobe connection interface. Alternatively, a connection interface may beconfigured such that number of connectors therewith matches the numberof connectors of a probe connection interface. A device employing such aconnection interface may be adaptable based on the “switchability” ofthe connection interfaces. For example, multiple connection interfacesmay be configured with a particular test device wherein each connectioninterface is configured for connecting to a particular probe connectioninterface. Alternatively, the test device may be configured with acommunications interface that allows for a connection interface to bereadily swapped out with other connection interfaces, wherein eachconnection interface is configured for particular probe connectioninterface.

In any case, once a determination is made as the type of probe and/orthe number of probe leads, software may be retrieved to perform probetesting, in the process element 504. The software modules may be devicespecific and/or configured to perform a particular test. For example, atest device may include a plurality of software modules wherein at leastsome number of the software modules is configured according toultrasound probe type. The software modules may call other more genericsoftware modules that are used to implement testing of a particularultrasound probe that is connected via the connection interface. Thetesting may reveal certain probe characteristics, in the process element505, once implemented.

In one embodiment, a processor, as directed by the software modules,generates control signals that are applied to ultrasound transducerleads via the connection interface, in the process element 506. Theprocessor may determine an ohmic response (e.g., conductivity of theleads), in the process element 507, to determine whether the transducerleads have been broken, detached, and/or shorted. For example, based ona resistance value, the processor may determine which transducer leadsare malfunctioning. Alternatively or additionally, the processor may beconfigured to generate control signals that test the transducers of theultrasound probe, in the process element 508. For example, the processormay pulse test signals to the leads via the connection interface suchthat the transducers radiate an acoustic pulse. In this regard, thetransducers may receive reflections of the acoustic pulse which arethereby converted into electronic signals. The processor may determine afrequency and/or phase response of such received signals, in the processelement 509, as described hereinabove.

Regardless of the test, the process 500 may formulate a report regardingthe operability of the acousto-electrical probe, in the process element510. For example, once certain transducer leads of an ultrasound probehad been deemed malfunctioning, a display interface may display a map ofthe probe connection interface that further identifies those transducerleads which are malfunctioning. Such a display may be performed in avariety of ways, many of which are described hereinabove. With themalfunctioning leads identified, the acousto-electrical probe may bereconfigured, in the process element 511 by, for example, reattachingand/or replacing transducer leads. Similarly, malfunctioning transducersmay be determined from frequency response displays such that individualtransducers may be repaired or the transducer “head” may be replaced.

Once the acousto-electrical probe is reconfigured, theacousto-electrical probe may be reintroduced to the medical industrysegment. For example, a doctor's office with a loaner ultrasound probemay return the loaner probe in exchange for the repaired ultrasoundprobe. Alternatively, the doctor's office may purchase a reconfiguredultrasound probe at a cost that may be substantially less than a newultrasound probe.

FIG. 11 is a block diagram of an exemplary ultrasound probecharacterization module 600. In this embodiment, the transducercharacterization module 600 may include certain features describedhereinabove, such as the Capacitance Scan Mode (e.g., capacitance testmodule 601) and the Ground Scan Mode (e.g., the probe type detectionmodule 602), as well as other features that may be used to characterizetransducers of an ultrasound probe. For example, the capacitance testmodule 601 may be used to test the capacitance of the electrical lead ofa transducer that is connected to the zero insertion force connector605. Such a test may include initially discharging capacitance in a leadfollowed by charging the capacitance of the lead until a certain voltagelevel has been attained, such as the 2.5 V described hereinabove. Duringthis charging of the capacitance, the microcontroller 611 may count suchthat a duration may be computed and a capacitance of the lead bedetermined therefrom. The capacitance test module 601 may perform thecapacitance test for each lead connected to the zero insertion forceconnector 605.

The probe type detection module 602 may use the Ground Scan Mode todetermine the type of ultrasound probe coupled to the zero insertionforce connector 605. For example, ultrasound probes are offered by avariety of manufacturers. These probes may, therefore, have varyingconfigurations including a varying number of transducer leads. The zeroinsertion force connector 605, in this regard, may be configured to“mate” with a variety of ultrasound transducer probe types. Thus, anyultrasound coupled to the zero insertion force connector 605 may requirean additional identification. The probe type detection module 602 mayperform a ground scan as described hereinabove to determine a number andconfiguration of transducer leads coupled to the zero insertion forceconnector 605. In this regard, the probe type detection module 602 maybe communicatively coupled to the microcontroller 611 where softwaremodules, also described hereinabove, may be called by themicrocontroller 611 to determine the type of ultrasound probe connectedto the zero insertion force connector.

Differing somewhat from the embodiments described hereinabove is thetransmit/receive module 610, which is used to determine the operationalcharacteristics of the transducers configured within an ultrasoundprobe. For example, the transmit/receive module 610 may include a pulsegenerator 609 that generates and transmits pulses that are used tostimulate individual transducers configured within an ultrasound probe.In one embodiment, the pulse generator 609 is configured to provideapproximately 75 V pulses at a pulse repetition frequency of 5 MHz. Inresponse to transmitting the pulses, the transmit/receive module 610 mayreceive the pulses as they are reflected from a target. The receivedreflected pulses may be digitized by the analog to digital converter 607such that they may be processed by the microcontroller 611. In thisregard, the microcontroller 611 may determine the frequency and/or phasecharacteristics of individual transducers. In particular, the ultrasoundprobe characterization module 600 may include software that is used bythe microcontroller 611 to observe ultrasound characteristics much likean ultrasound medical device would.

Also configured with the ultrasound probe characterization module 600 isa universal ground connection module 603. The universal groundconnection module 603 provides ground connections to selected transducerleads. For example, when a technician is characterizing an ultrasoundprobe, the technician may require ground connections to one or more ofthe transducer leads within the ultrasound probe. The universal groundconnection module 603 may provide a simultaneous connection to groundfor selected transducer leads (e.g., regardless of the ultrasound probetype) as opposed to scanning the individual transducer leads employed bythe Ground Scan Mode. In one embodiment, the universal ground connectionmodule 603 includes an open collector/drain array that providesrelatively high-voltage and low resistance when “turned on”.

Additionally, the ultrasound probe characterization module 600 mayinclude a multiplexer (MUX) driver module 614 that is used to driveindividual transducers of the probe when desired. For example, the MUXdriver module 614 may be coupled to a MUX array 615 which in turncouples the MUX driver module 614 to individual transducer leads of anultrasound probe coupled to the zero insertion force connector 605.Instead of merely applying a voltage, the MUX driver module 614 maytransmit a plurality of signal types including data signals, clocksignals, voltages, variable voltage waveforms, etc. These signals may beused to selectively test the transducer leads and/or the transducers ofan ultrasound probe. For example, a technician may wish to determine thedata transfer characteristics of a particular transducer lead. In thisregard, the technician may transmit a data signal to the selectedtransducer lead. Other leads, which are not necessarily transducerleads, within the ultrasound probe may be similarly tested. In anotherexample, the technician may transfer a clock signal through ultrasoundprobe lead to determine possible data transfer rates for the lead.

The ultrasound probe characterization module 600 may also include adisplay 612 that is communicatively coupled to the microcontroller 611to display information to a technician. For example, the ultrasoundprobe characterization module 600 may be configured as a portable toolthat may be used by a technician in the field. A built-in display 612may provide the technician with valuable information (e.g., capacitancetest information of transducer leads, broken lead identification,acoustic/electrical characteristics of an ultrasound probe, the numberof transducers that are operational, etc.) when attempting to repair orat least diagnose an inoperable ultrasound probe. In this regard, themicrocontroller 611 may process information from a particular test(e.g., from the capacitance test module 601, the prototype detectionmodule 602, etc.) and display the results of that test with the built-indisplay 612 for observation by the technician.

Alternatively or additionally, the ultrasound probe characterizationmodule 600 may include a Bluetooth driver 613 which may be used tocommunicate information regarding a particular test to a devicemaintained by the technician. For example, test information may bewirelessly transferred from the ultrasound probe characterization module600 to a handheld device (e.g., a cell phone, a PDA, a smart phone, alaptop computer, etc.) for observance and/or additional processing.While a Bluetooth driver 613 may be particularly useful for wirelesslytransmitting information from one device to another, the invention isnot intended to be limited to such a wireless transfer. For example,other wireless communication means may be employed as well as wiredcommunication means (e.g., serial communications or parallel tomedications).

Also shown in this embodiment is the test selection module 606. The testselection module 606 may be implemented in a variety of ways. In thisembodiment, the test selection module 606 is implemented as a logical ORgate to select which tests may be performed on an ultrasound probeconnected to the zero insertion force connector 605. For example, atechnician using the ultrasound probe characterization module 600 mayselect a test through the built-in display or other means, such as abutton. The microcontroller 611 may transfer a selection signal to thetest selection module 606 such that a desired test is selected.

FIG. 12 is an illustration of an exemplary reflection module 650. Inthis embodiment, the reflection module 650 may be configured forattaching to an ultrasound probe 655 such that acoustic signals may betransmitted from and reflected to the ultrasound probe 655 duringtesting. For example, the reflection module 650 may include a housing654 that includes reflective elements 652, 651, and 653 that reflectsacoustic signals 656 from the ultrasound probe 655 along a particularpath. As the acoustic signals 656 impinge the reflective element 653,the reflected signals 657 are propagated back along the same path to theultrasound probe 655 such that the signals may be received by thetransducers of the ultrasound probe and subsequently processed by anultrasound characterization module, such as that shown in FIG. 11.

The reflection module 650 may include a transmissive medium 658 that isused to propagate the acoustic signals (e.g., acoustic signals 656 and657). The transmissive medium 658 may be configured in a variety of waysthat alleviate the need for testing the ultrasound probe 655 in a“bath”. For example, ultrasound probe testing often required use of awater bath in some sort of container to propagate acoustic signals froman ultrasound probe through the water bath for reflection back to theultrasound probe, where the acoustic signals would be received by thetransducers of the probe and processed by the ultrasound test equipment.This bath requirement often makes testing in the field impractical or,in some cases, impossible. Thus, testing of an ultrasound probepreviously needed to be transferred to a test facility where propertesting could be performed (i.e., using a water bath or another type ofliquid bath). The reflection module 650 overcomes such obstacles byproviding a transmissive medium 658 in a self-contained housing 654.While the transmissive medium 658 may be configured in a variety ofways, one exemplary media may include silicone. However, since thereflection module 650 includes the self-contained housing 654 othermediums may be used, such as gels, foams, room temperature vulcanizedmaterial, or any other elastic material capable of propagating acousticwaves.

Additionally, the illustrated reflection module 650 is not intended tolimit the invention to a particular number of reflection elements.Rather, the reflection module 650 illustrates one exemplary manner whichprovides a means for forming a propagation path of a certain length,such as that distance used in an ultrasound probe bath. Other lengths orconfigurations of propagation may be implemented as a matter of designchoice. For example, a reflection module may be configured with a singlereflective element that directly receives acoustic waves from theultrasound probe and directly reflects the waves to the ultrasoundprobe.

While the invention has been illustrated and described in detail in thedrawings and foregoing description, such illustration and description isto be considered as exemplary and not restrictive in character. Forexample, certain embodiments described hereinabove may be combinablewith other described embodiments and/or arranged in other ways (e.g.,process elements may be performed in other sequences). Additionally, theembodiments shown and described herein may provide certain advantages inquickly diagnosing and repairing ultrasound probes of the medicalindustry. However, the invention is not intended to be limited to themedical device industry. Rather, the embodiments above may provide ameans for addressing a variety of acoustic devices that use transducers.Accordingly, it should be understood that only the preferred embodimentand variants thereof have been shown and described and that all changesand modifications that come within the spirit of the invention aredesired to be protected.

1. An acousto-electrical probe testing apparatus comprising: aconnection interface to connect to a plurality of acousto-electricalprobes of different probe types having different numbers of transducerleads, the connection interface to be configured to accommodate aselected acousto-electrical probe based on connection type informationidentified for a probe type associated with the selectedacousto-electrical probe; and a processor to identify the probe type ofa first acousto-electrical probe when the first acousto-electrical probeis coupled to the connection interface based on an interrogation ofconnectors in the connection interface to determine a number of leadscoupled to the connection interface, the processor to: trigger a test ofthe first acousto-electrical probe based on the probe type, the testincluding generation of a control signal to be applied to the leads ofthe first acousto-electrical probe coupled to the connection interface;and process a plurality of responses to the control signal from theleads of the first acousto-electrical probe to determine when a lead isat least one of broken or detached from the first acousto-electricalprobe.
 2. The apparatus of claim 1, wherein the first acousto-electricalprobe includes an ultrasound probe.
 3. The apparatus of claim 1, whereinthe control signal includes a control signal generated to determine anohmic response related to conductivity of the leads.
 4. The apparatus ofclaim 1, wherein the control signal includes a pulse test signal to besent to the leads to produce an acoustic pulse radiating from the leads.5. The apparatus of claim 4, wherein the processor is to convertreceived reflections of the acoustic pulse into an electronic signal. 6.The apparatus of claim 5, wherein the processor is to determine at leastone of a frequency or phase response of the electronic signal todetermine when a lead is at least one of broken or detached from thefirst acousto-electrical probe.
 7. The apparatus of claim 1, wherein theinterrogation of connectors in the connection interface by the processorincludes generating a second control signal to determine a configurationof the first acousto-electrical probe coupled to the connectioninterface.
 8. The apparatus of claim 1, wherein the processor is tomultiplex a plurality of control signals based on the probe type.
 9. Theapparatus of claim 1, further including a test probe to be contacted bya lead of the first acousto-electric probe to apply the control signalto the leads of the first acousto-electrical probe.
 10. The apparatus ofclaim 1, wherein the processor is to operate in one of a plurality ofoperational modes based on configuration of the apparatus.
 11. Theapparatus of claim 10, wherein the plurality of operational modesincludes a ground scan mode to identify a lead improperly connected toground.
 12. The apparatus of claim 10, wherein the plurality ofoperational modes includes a probe scan mode to identify a lead incontact with a test probe.
 13. The apparatus of claim 10, wherein theplurality of operational modes includes a capacitance scan mode todetermine a relative capacitance of each lead on the firstacousto-electrical probe.
 14. The apparatus of claim 1, furtherincluding a counter to increment during the test of the firstacousto-electrical probe.
 15. The apparatus of claim 1, wherein theapparatus further includes a memory including software to be executed bythe processor to test and a library of known probe types to configurethe test and the connection interface.
 16. The apparatus of claim 1,further including a multiplexer to drive individual transducers of thefirst acousto-electrical probe.
 17. The apparatus of claim 1, furtherincluding a display interface to output information when a lead is atleast one of broken or detached from the first acousto-electrical probe.18. The apparatus of claim 1, wherein the connection interface is toenable the processor to test at least a single lead of the firstacousto-electrical probe.
 19. The apparatus of claim 18, wherein thesingle lead is to be selected by the processor using a multiplexer. 20.The apparatus of claim 1, further including a comparator to compare aresponse to the control signal with a reference signal.